What is chip on-chip?

Chip on-Chip (CoC) refers to the integration of multiple microchips on a single chip or substrate. This concept enables the creation of highly compact semiconductor devices with high levels of integration, which in turn result in enhanced performance, reduced power consumption, and lower costs.

CoC technology involves stacking multiple microchips vertically or horizontally, using advanced bonding methods to interconnect them. This creates high-density and high-speed interconnection pathways between the different layers of chips, resulting in improved signal transmission and lower power consumption.

The main advantage of CoC technology is that it enables designers to combine and integrate various types of chips, such as microprocessors, memory chips, and communication chips, on a single platform. This increases the overall performance and functionality of the device while reducing the overall size and cost of the system.

CoC technology has already found applications in areas such as mobile devices, Internet of Things (IoT) devices, wearables, and advanced computing systems. The technology is expected to continue to play a critical role in the development of future semiconductor devices that require high performance and miniaturization.